IES

• Processor: STM32F107VC 32-bit ARM Cortex-M3 Core based MCU, 72MHz
• Internal memory: 256KB Flash & 64KB RAM
• Power supply by USB
• Support touchscreen connector interface extention
• 1 x 2.4 inch TFT LCD Panel with touch screen, 320*240
• 1 x mini USB interface supporting USB OTG
• 1 x 10/100Mb Ethernet interface
• 1 x Micro SD Card interface
• 1 x SPI interface
• 1 x IIC interface
• 1 x TFT LCD interface
• 1 x 20pins JTAG Debug interface
• 1 x potentiometer
• 4 x seven-segment digitron tube
• 1 x speaker
• 1 x earphone port
• 1 x five-position Joystick
• 1 x temperature sensor
• 4 x LEDs
• 1 x Reset button
• 54 I/O pins extension(PA0~8, PB0, PB1, PB5~9, PB12~15, PC0~13, PD0~12, PE0, PE2~7)

• 1 x Embest STM32F107 ARM Cortex-M3 Board
  
• 1 x Mini USB Cable
  
• 1 x Serial Cable
  
• 1 x Net Cable
  
• 1 x 2.4 inch TFT LCD Panel
  
• 1 x CD-ROM

STMicroelectronics is the world's fifth largest semiconductor company with net revenues of US$9.84 billion in 2008.

 STMicroelectronics was created in 1987 by the merger of SGS Microelettronica of Italy and Thomson Semiconducteurs of France. Since its formation, ST has grown faster than the semiconductor industry as a whole and it has been one of the world's Top Five semiconductor suppliers since 2005.

 The group totals over 50,000 employees, 16 advanced research and development units, 39 design and application centers, 15 main manufacturing sites and 78 sales offices in 36 countries.

 Corporate Headquarters, as well as the headquarters for Europe, the Middle East and Africa, (EMEA) are in Geneva. The Company's U.S. Headquarters are in Carrollton (Texas); those for Asia-Pacific are based in Singapore and Japanese operations are headquartered in Tokyo. The "Greater China" region, which includes Hong Kong, China and Taiwan, is headquartered in Shanghai.

 ST has a worldwide network of front-end (wafer fabrication) and back-end (assembly and test and packaging) plants. ST's principal wafer fabs are presently located in Agrate Brianza and Catania (Italy), Crolles, Rousset and Tours (France), and Singapore. The wafer fabs are complemented by highly efficient assembly and test facilities located in China, Malaysia, Malta, Morocco and Singapore.