IES

• Supporting WinCE6.0, Linux2.6.24, Android and Ubuntu OS
  
• Processor: Samsung ARM S3C6410, ARM1176JZF-S, up to 667MHz.
  
• 128MB DDR SDRAM, 166MHz
  
• 256MB NAND Flash, 16bit
  
• 2M Bytes NOR Flash
  
• TFT LCD and Touch Screen interface, supporting 3.5", 4.3", 7" TFT LCD Panel
  
• 50-Pin GPIO connector ,50-Pin data and address BUS connector
  
• S-Video display interface
  
• One TVOUT interface
  
• One VGA interface
  
• One 10-pin A/D interface
  
• Two 20-pin SPI interface, it can connect WIFI,DTV Module
  
• One audio input interface (3.5mm audio jack)
  
• One 2-channel audio output interface (3.5mm audio jack)
  
• One 10/100M Ethernet interface (RJ45)
  
• One High-speed USB2.0 OTG port (Mini USB type interface)
  
• Four serial ports (Two are five-wire RS-232 DB9 interface, another two are three-wire TTL serial port led out from a 20-pin expansion connector)
  
• SD/MMC interface (supports 3.3V and 1.8V logic voltage)
  
• Two camera interfaces (30-pin FPC connector, support CCD or CMOS camera)
  
• One 20-pin JTAG interface, one 10-pin CPLD JTAG interface
  
• Eight buttons (Reset, Boot, User defined, On/Off)
  
• Power supply: +12V
  
• Temperature range : 0 °C to 70 °C
  
• Many modules are available for your choice- GPS, WIFI, Camera, USB HUB and Matrix Keyboard Module
• Modular Design: carrier board-200mm x 140mm; CPU board- 81.2mm x 55.8mm

This section summarizes the features of the S3C6410X. Figure 1-1 is an overall block diagram of the S3C6410X.

Figure 1-1 the block diagram of the S3C6410X.

• The ARM1176JZF-S based CPU subsystem with Java acceleration engine and 16KB/16KB I/D Cache and 16KB/16KB I/D TCM.
  
• 533MHz at 1.1V and 667MHz at 1.2 V respectively.
  
• 8-bit ITU 601/656 Camera interface up to 4M pixel for scaled and 16M pixel for unscaled resolution.
  
• Multi Format Codec provides encoding and decoding of MPEG-4/H.263/H.264 up to 30fps@SD and decoding of VC1 video up to 30fps@SD.
  
• 2D graphics acceleration with BitBlit and rotation.
  
• 3D graphics acceleration with 4M triangles/s @133Mhz (Transform only)
  
• AC-97 audio codec interface and PCM serial audio interface.
  
• 1/2/4bpp Palletized or 16bpp/24bpp Non-Palletized Color-TFT
  
• I2S and I2C interface support.
  
• Dedicated IrDA port for FIR, MIR and SIR.
  
• Flexibly configurable GPIOs.
  
• Port USB 2.0 OTG supporting high speed as Device (480Mbps, on-chip transceiver).
  
• Port USB 1.1 Host supporting full speed (12Mbps, on-chip transceiver).
  
• SD/MMC/SDIO/CE-ATA Host Controller
  
• Real time clock, PLL, timer with PWM and watch dog timer.
  
• 32 channel DMA controller.
  
• Support 8x8 key matrix.
  
• Advanced power management for mobile applications.
  
• Memory Subsystem:
  - SRAM/ROM/NOR Flash Interface with x8 or x16 data bus.
  - Muxed OneNAND Interface with x16 data bus.
  - NAND Flash Interface with x8 data bus.
  - SDRAM Interface with x32(Port1) data bus.
  - Mobile SDRAM Interface with x32(Port1) data bus
  - DDR Interface with x32(Port1 ) data bus
  - Mobile DDR Interface with x32(Port1 ) data bus

• High-speed Advanced Microprocessor Bus Architecture (AMBA) Advanced Extensible Interface (AXI) level two interfaces supporting prioritized multiprocessor implementations.
  
• Integer unit with integral EmbeddedICE-RT logic.
  
• Eight-stage pipeline.
  
• Branch prediction with return stack.
  
• Low interrupt latency configuration.
  
• Coprocessors CP14 and CP15.
  
• Instruction and Data Memory Management Units (MMUs), managed using MicroTLB structures backed by a unified Main TLB.
  
• Instruction and data caches, including a non-blocking data cache with Hit-Under-Miss (HUM).
  
• Virtually indexed and physically addressed caches.
  
• 64-bit interface to both caches.
  
• Vector Floating-Point (VFP) coprocessor support.